封装材料与技术 (于严淏)MSE50362023秋 2022秋  
2023秋 2022秋
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选课类别:专业任务 教学语言:英文
课程类别:专业选修课 开课单位:材料科学与工程系
课程层次:研究生 获得学分:3.0
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课程简介(教工部数据)
封装材料与技术是芯片、LED、太阳能电池、储能电池等多种电子和能源系统稳定运行的关键。本课程讲授封装系统中的材料科学基础知识,内容包括封装介绍、热力学与动力学基础、断裂力学基础、陶瓷封装材料、高分子封装材料、微电子封装、有机发光二极管封装、生物医疗器件封装、太阳能电池封装、储能电池封装、光电化学器件封装等。通过本课程的学习,学生将具备封装相关的材料、物理、化学、力学基础知识,了解目前封装主要设计和工艺路线,把握新兴电子和能源系统的封装需求和发展方向,为未来在封装领域的研究和工作打好基础。


Packaging materials and technology ensures theoperational stability of electronic and energy systems such as semiconductorchips, light emitting diode, solar cells, energy storage batteries. This course emphasizes thematerials science fundamentals in packaging systems. The content includes basicconcepts of packaging materials, thermodynamics and kinetics, fracturemechanics, ceramic packaging materials, polymer packaging materials,microelectronic packaging, OLED packaging, packaging for biomedical devices,solar cell packaging, battery packaging, packaging for photoelectrochemical devices,and et. al. After taking this course, the students will acquire the materials,physics, chemistry, mechanics knowledge about packaging. They will know themain material and technological designs in current packaging industry. Theywill get familiar with the packaging needs and trends in emerging electronicand energy systems and be prepared for the future research and work in the packaging area.  
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于严淏

材料科学与工程系

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