电子封装结构中的高分子材料失效行为

"1. To provide the students with a basic understanding of the roles that polymer materials playing in the microelectronic and microsystem packages (e-package) and its importance in product design.2. To provide the students with an understanding on physical and chemical properties of polymer materials that are critical in e-packge reliability. .3. To introduce the concept of material selection and design for assembly and manufacturing of e-packages.4. To introduce the failure behavors and mechanisms of e-packages due to polymer materials failure.5. To introduce the charaterization and simulation tools that are used in e-package design and realibility assessment6. To provide students with basic knowledge on the insutry size of e-package manufacturing and the understanding the controlling factors that dectating the quality of massive production in reality"