电子封装与异质集成
（曾玉强）SME50352024秋2024秋
(暂无评价)
- 课程难度：你猜
- 作业多少：你猜
- 给分好坏：你猜
- 收获大小：你猜
| 选课类别：专业任务 | 教学语言：中文 |
| 课程类别：专业核心课 | 开课单位：深港微电子学院 |
| 课程层次：未知 | 获得学分：3.0 |
课程主页：暂无（如果你知道，请点右上角“编辑课程信息”添加！）
课程简介（教工部数据）
该课程利用理论和实验室教学方法，介绍了现代电子封装设计和表征的基本概念，特别讨论了微电子封装的电气、热和机械考虑因素，以及材料选择、封装制造和统计建模。该课程采用为期16周的授课和实验室教学模式。本课程涵盖的主题包括：电子封装概述；电气设计和表征；热设计和表征；机械设计和表征；材料选择和表征；封装制造；统计建模和数据分析；辐射硬化。
Thiscourse leverages both theoretical and laboratory-based instruction methods tointroduce concepts needed for an introductory understanding of the design andcharacterization of modern electronic packages. In particular, electrical,thermal, and mechanical considerations for microelectronics packing will bediscussed along with material selection, package fabrication and statisticalmodeling. The course is based on a 16-weekdelivery format for both lectures and labs.Topics Covered in this course: 1. Overview ofelectronics packaging; 2. Electrical design and characterization; 3. ThermalDesign and characterization; 4. Mechanical design and characterization; 5. Materialselection and characterization; 6. Package fabrication; 7. Statistical modelingand data analysis; 8 Radiation hardening.
点评写点评
还没有评论耶！放着我来！
