半导体芯片封装测试与可靠性

Integrated circuit industry consists of three parts: chip design, wafer manufacturing, and package testing, this course aims to enable students to learn and understand the packaging testing and reliability of chips, so that students realize that packaging plays an increasingly important role in the integrated circuit industry. The content includes IC chip package overview, packaging process, ceramic packaging, plastic packaging, hermetic packaging, packaging reliability Engineering, defect analysis in the packaging process and advanced packaging technology. Through this course, students can easily understand the packaging industry, understanding packaging technology and process flow, and understanding advanced packaging technology. Learn the ability of analysis and solution of packaging technology.